The full name of SOC chip is system-on-a-chip. In Chinese, it means “make the system on one chip”. If we say that the core of a computer is CPU in the era of PC, then in the era of intelligent terminal, the core of mobile phone is SOC.
SoC 的全称叫做：System-on-a-Chip，中文的的意思就是“把系统都做在一个芯片上”，如果在 PC 时代我们说一个电脑的核心是 CPU，那么在智能终端时代，手机的核心就是这个 SoC。
The full name of SOC is system-on-a-chip. In Chinese, it means “make the system on a chip”. If we say that the core of a computer is CPU in the era of PC, then in the era of intelligent terminal, the core of mobile phone is SOC.
SoC chip is a kind of integrated circuit chip, which can effectively reduce the development cost of electronic / information system products, shorten the development cycle, and improve the competitiveness of products. It is the most important product development mode to be adopted by the industry in the future.
SoC 上集成了很多手机上最关键的部件，比如 CPU、GPU、内存、也就说虽然它在主板上的存在是一个芯片，但是它里边可是由很多部件封装组成的。比如通常我们所说的高通 801，Tegra 4，A6 等等都只是系统部件打包封装（SoC）后的总称。然而各家的打包封装的内容则不尽相同，原因也不尽相同。
SOC integrates many key components of mobile phones, such as CPU, GPU, memory, which means that although its existence on the motherboard is a chip, it is composed of many components. For example, the Qualcomm 801, Tegra 4, A6 and so on are just the general term after system component packaging (SOC). However, there are different contents and reasons for packaging.
高通的 SoC 集成度往往是较高的，有 AP/CPU（Krait），GPU（Adreno），RAM（运行内存），Modem（通信模块），ISP（图像处理），DSP（数字信号处理），Codec（编码器）等等等等。这么多部分当中，以 Modem 通信模块高通的优势最大，高通之所以受到欢迎的一个原因就是集成度高，将所有的系统所需功能都在一个芯片当中提供了，手机厂商不需要额外采购（省成本），主板空间也会更加富裕，也有助于降低功耗。
Qualcomm’s SOC integration is often high, including AP / CPU (krait), GPU (Adorno), RAM (running memory), modem (communication module), ISP (image processing), DSP (digital signal processing), codec (encoder), etc. Among all these parts, the advantage of Qualcomm, the modem communication module, is the biggest. One of the reasons why Qualcomm is popular is its high integration. All the functions required by the system are provided in one chip. Mobile phone manufacturers do not need to purchase extra (save costs), and the motherboard space will be richer, which also helps to reduce power consumption.
当然手机厂家在设计终端产品的时候也会根据自己的需求“部分采用”SoC 当中集成的功能。比如 SmartisanT1 当中并没有采用高通 SoC 当中自带的 ISP（图像处理器），而是在 SoC 之外单独放置了一颗富士通的 ISP。再比如有些厂家选择不采用高通 SoC 当中的音频处理模块，而额外的采购 Audience 作为降噪方案。再比如 Vivo 选择在 SoC 之外外挂一串高端音频芯片，增加 Hi-Fi 表现，都是这种“部分采用”的案例。
Of course, when designing terminal products, mobile phone manufacturers will “partially adopt” the functions integrated in SoC according to their own needs. For example, smartisant1 does not use the ISP (image processor) that comes with Qualcomm SOC, but places a Fujitsu ISP separately from the SOC. For another example, some manufacturers choose not to use the audio processing module in Qualcomm SOC, but to purchase additional audience as the noise reduction scheme. For example, vivo chose to plug in a series of high-end audio chips outside the SOC to increase hi fi performance, which are all examples of “partial adoption”.
有 SoC 供应商，或出于技术障碍，或出于战略需要，则选择在 SoC 当中集成更多，或者更少的组件。比如，苹果一直选择将 Modem 模块放在 A 系列处理器之外，不封装在 SoC 里，就或多或少有不希望长期受制于高通的考虑，并且有传言说苹果自己也在研发自己的 Modem 模块，这个思路按照苹果长期垂直大整合的战略来看，非常符合苹果的利益。
There are SOC suppliers, either for technical barriers or for strategic needs, who choose to integrate more or fewer components in the SOC. For example, Apple has always chosen to put the modem module out of the A-Series processor and not encapsulated in the SOC, which is more or less not expected to be subject to Qualcomm’s consideration for a long time. There are rumors that apple is also developing its own modem module. This idea is in Apple’s interest according to the long-term vertical integration strategy of apple.